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Hitech Wafer Specifications & Fabrication Process | Premium Wafer Manufacturer
Hitech Wafer Specifications
As a leading wafer manufacturer, Hitech produces high-precision wafers fully compliant with SEMI Standards, covering dimensional tolerances, flatness, and notch configurations, ensuring consistent quality for diverse industrial uses.
Beyond standard offerings, Hitech provides custom wafer solutions for unique needs. Customization options include alignment marks, precision-drilled holes, edge profiles, thickness/flatness calibration, surface refinement, enhanced cleanliness, and other specified parameters.
Hitech supplies wafers made from premium materials: borosilicate, aluminosilicate, fused silica (high-performance quartz alternative), quartz, and soda lime, tailored for optoelectronics, MEMS, semiconductor, and aerospace industries.
Hitech Wafer Technical Parameters (Reserved for Parameter Table)
Attribute Category | Attribute Name | Specifications | Notes/Standards Reference |
Basic Dimensions | Diameter | Φ2", Φ3", Φ4", Φ5", Φ6", Φ8", Φ12" | Standard sizes; Custom diameters available upon request |
Basic Dimensions | Thickness | 0.2mm, 0.3mm, 0.4mm, 0.5mm, 0.7mm, 1.0mm, 1.5mm | Custom thicknesses customizable |
Dimensional Precision | Dimensional Tolerance | ±0.02mm | Compliant with SEMI Standards |
Dimensional Precision | Thickness Tolerance | ±5μm | - |
Dimensional Precision | Total Thickness Variation (TTV) | 01mm (10μm) | - |
Flatness & Parallelism | Flatness | 1/10 Wave per Inch | Measured at 633nm wavelength (optical standard) |
Surface Quality | Surface Roughness (RMS) | 5nm | Super-polished surface option available |
Surface Quality | Scratch and Dig | 5/2 | Per MIL-PRF-13830B industry standard |
Surface Contamination | Particle Size | 5μm (max particle diameter) | Detected in Class 100 Clean Room |
Mechanical Stability | Bow/Warp | μm | Ensures processability in wafer-level manufacturing |
Hitech Wafer Fabrication Process
Hitech adopts a precision-focused fabrication process with strict quality control. The step-by-step workflow is as follows:
1. Shape Cutting
Hitech uses material-specific cutting for wafer blanks: high-precision scribing for thin sheets, water jet for thick sheets, and wire sawing for glass blocks (ultra-uniform results).
2. CNC Edge Profiling
Each Hitech wafer undergoes CNC edge grinding for consistent, high-precision edges, complying with strict standards while reducing chipping and boosting stability.
3. Lapping
On request, wafers are lapped to achieve exact thickness and flatness tolerances for specialized high-precision applications.
4. Polishing
Double-side Commercial Polish: Removes subsurface damage, improves smoothness, and meets general industrial needs.
Super Polish: Delivers a defect-free surface for high-precision fields (advanced optoelectronics, MEMS, semiconductors).
5. Cleaning
Wafers go through multi-stage ultrasonic/megasonic cleaning, then are transferred to a Class 100 Clean Room to avoid recontamination.
6. Inspection
All wafers undergo rigorous inspection in a Class 100 Optical Clean Room, with application-specific lighting to verify compliance with custom criteria.
7. Packaging
Finished wafers are vacuum-sealed, double-bagged in pre-cleaned containers (Class 100 Clean Room), ensuring cleanliness and protection during storage/transport.