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Company Overview
Hitech Glass leverages the booming development of domestic panel display and solar optoelectronic industries, collaborating with universities and research institutes to drive technological innovation. We delivering full-chain solutions from substrate manufacturing to precision processing and specialize in OLED-spec ITO conductive substrates, Mo Al Mo metal substrates, and comprehensive services including coating, lithography, and packaging solutions.
Core Products & Services
1. Optoelectronic Glass Products
· Display Substrates: OLED-specific ITO conductive substrates and MoAlMo metal substrates for precise components like gate electrodes and pixel electrodes.
· Packaging & Lithography Components: Grooved covers and exposed pattern etching products for OLED packaging and circuit patterning.
· Functional Coated Materials: ITO, Ti, Al, Mo, and other metal/oxide coated substrates for conductive and optical applications.
2. Full-Process Services
· Coating Technology: PVD magnetron sputtering (Ar ion sputtering) to deposit Mo, Al, ITO films for electrode formation.
· Lithography Processes: Yellow photolithography etching, PR coating/development, UV exposure (8μm precision), with Nikon lithography machines achieving ±1μm alignment.
· Precision Processing: Wet etching (mixed acid spraying/soaking), polishing (ITO substrate Ra ≤0.6nm), and packaging cover grooving.
3. Customization Model
· Free sample testing + technical support, with customizable specifications and sizes.
· One-stop solutions from substrate cleaning (EUV for organics + Brush for particles) to final cutting.
Technological Capabilities & Equipment
1. Key Processes & Parameters
Process | Technical Highlights | Capacity |
PVD Sputtering | ULVAC equipment (70%+ market share), film uniformity ≤4% (ITO), roughness Ra 0.4~0.6nm | ITO: 15K/month, Metal: 20K/month |
Lithography & Etching | Nikon lithography (Class 1000 clean room), ±1μm auto-alignment, wet etching for ITO/metal | 60K sheets/month |
Packaging Cover Machining | Domestic etching machines, groove depth 0.1~0.7mm (±0.05mm tolerance), HF acid etching | >10,000 large sheets/month |
2. Equipment Advantages
· ULVAC Magnetron Sputter Coater: Processes 650*500mm substrates (0.4~1.8mm thickness), capacity >30,000 sheets/month.
· Yongchuang Precision Grinder: 400*500mm polishing, post-grinding ITO Ra as low as 0.396nm .
· Bando Cutting & Edging Machine: Max cutting size 1400*1600mm, capacity >50,000 sheets/month.
Contact & Conversion
For free sample testing or customized solutions, contact Hitech Glass - leveraging ULVAC coating equipment and Nikon lithography technology to deliver high-precision optoelectronic glass deep processing from substrate to finished product.